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IEDM 2016 Next Week! (Part 2)
By Dick James, Senior Technology Analyst, Chipworks Read Part 1 here. Now for the second part of the preview, starting with the Tuesday afternoon sessions: Session 17: Process and Manufacturing...
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IEDM 2016 – Setting the Stage for 7/5 nm
By Dick James At IEDM last month, there was much ado about the adjacent 7-nm late-news papers from TSMC and the GLOBALFOUNDRIES/IBM/Samsung group consortium from the Albany Nanotechnology Center, and...
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Intel’s 10nm Enigma
By Dick James I’ve been looking back at the talk given by Mark Bohr and Zane Ball (Building Winning Products with Intel® Advanced Technologies and Custom Foundry Platforms) at the Intel Developer Forum...
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Intel Unveils More 10nm Details
By Dick James On March 28, Intel held a Technology and Manufacturing Day in San Francisco, not surprisingly focusing on the work of the Technology and Manufacturing Group (TMG) within the company. This...
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IEDM 2017 Next Week Part 1
By Dick James On December 2nd – 6th the good and the great of the electron device world will make their usual pilgrimage to San Francisco for the 2017 IEEE International Electron Devices Meeting. To...
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IEDM 2017 Next Week Part 2
Part 1 of Dick James’ preview can be read here. By Dick James Wednesday Most of the sessions Wednesday morning are limited to five papers, since we have a second plenary session (30) at 11.10 am....
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IEDM 2017: Intel’s 10nm Platform Process
By Dick James IEDM this year was its usual mixture of academic exotica and industrial pragmatica (to use a very broad-brush description), but the committee chose to keep us all waiting until the...
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IEDM 2018 Coming Up!
This is Part 1 of a multi-part blog series of previews of the upcoming IEDM 2018 conference. By Dick James On December 1st– 5ththe good and the great of the electron device world will make their usual...
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The Packaging of Apple’s A12X is… Weird
By Dick James Watching the video from the new iPad Pro launch back on October 30, there was a pseudo assembly sequence within it. Being the teardown nerd that I am, I kept running through it until I...
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Intel announces tweaks to 22FFL process for RF, MRAM at IEDM18
By Dick James At IEDM last year, Intel gave a half-dozen papers on various topics, including two on their 22FFL SoC process aimed at low power IoT and mobile products. The first (14.1) was an invited...
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