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Economy Threatens Semi Growth, not Technology – so Say Fab Engineers at ASMC
It’s still spring in the north-eastern part of North America, and that means it’s the time of year for the Advanced Semiconductor Manufacturing Conference, in the amiable ambiance of Saratoga Springs,...
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A Dispatch from SEMICON West – Applied Materials Launches Epi System Focused...
Flying in to SFO on July 7, I must have been one of many attendees delayed by the after-effects of the Asiana Airlines crash there the day before. In my case it was only an hour or so (i.e. as normal),...
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Qualcomm Snapdragon 800 and Rockchip RK3188 – Battle of the Foundries!
The Snapdragon 800 (Qualcomm MSM8974) is Qualcomm’s leading-edge, low-power, mobile phone app’s processor with built-in 3G/4G LTE modem, using the latest Krait 400 CPU rated at 2.3 GHz and their 450...
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Apple A7 uses Samsung’s 28nm process
Last week, we started tearing down the Apple iPhone 5S. There has been much speculation that Apple would be moving their processor chips over to TSMC, but I think that we can now decisively say that...
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GLOBALFOUNDRIES to make Apple chips in New York fab?
I normally don’t have the time to follow local press, but occasionally Google Alerts pops up with something quite interesting. In this case, the Albany Times Union from Albany, New York had an...
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IEDM 2013 Preview
Next week, the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2013 IEEE International Electron Devices Meeting. To quote the conference web...
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Intel’s e-DRAM Shows Up In The Wild
When Intel launched their Haswell series chips last June, they stated that the high-end systems would have embedded DRAM, as a separate chip in the package; and they gave a paper at the VLSI Technology...
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TSMC 20nm Arrives – The First Shoe Drops
By Dick James, Senior Technology Analyst, Chipworks For us at Chipworks interested in leading edge processes, 2014 so far has been the year of waiting for parts and processes that have been announced,...
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The Second Shoe Drops – Now We Have the Samsung V-NAND Flash
By Dick James, Senior Technology Analyst, Chipworks Two weeks ago, we posted about the TSMC 20nm product that we had in-house; now after waiting for a year since Samsung’s announcement of V-NAND...
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Intel’s 14nm Parts are Finally Here!
By Dick James, Chipworks Earlier last week, a couple of laptops arrived from Japan using the Core M version of Intel’s Broadwell processor. Straight into the lab, and within a few hours the first sight...
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IEDM 2014 Preview
By Dick James, Chipworks Later this month, the good and the great of the electron device world will make their usual pilgrimage to San Francisco for the 2014 IEEE International Electron Devices...
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IEDM – Monday was FinFET Day
By Dick James, Senior Analyst, Chipworks In my conference preview blog last week, I mentioned that session 3 on the Monday afternoon would be a hot session, with three finFET papers, by TSMC, Intel,...
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Samsung’s FinFETs ARE in the Galaxy S6!
By Dick James, Senior Technology Analyst, Chipworks The much anticipated Samsung Galaxy S6 made an early appearance in our teardown labs last week, thanks to the diligent skills of our trusted...
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Apple Watch Launch Confirms WiFi and NFC Inside
By Dick James, Senior Technology Analyst, Chipworks Today (April 10) is the day that the Apple Watch becomes available for order, and of course we will be buying some to see what’s inside. We won’t be...
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The Confab – Semi Industry is Now Mature
By Dick James, Senior Technology Analyst, Chipworks The Confab started on Tuesday last week, an industry get-together organised by Solid State Technology (part of Extension Media), which they promote...
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Apple Watch and ASE Start New Era in SiP
By Dick James, Senior Technology Analyst, Chipworks Back in April the Apple watch appeared in our labs, and of course we pulled it apart to see its contents. That set us some challenges, since inside...
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A Look Ahead at IEDM 2015
By Dick James, Senior Technology Analyst, Chipworks In the second week of December, the good and the great of the electron device world will make their usual pilgrimage to Washington D.C. for the 2015...
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Intel/Micron Detail Their 3D-NAND at IEDM
By Dick James, Senior Technology Analyst, Chipworks On the Monday afternoon at IEDM the key paper for me was the Intel/Micron talk on their 3D-NAND flash part (paper 3.3), which is currently sampling...
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What to Expect in 2016 in the Chipworld
By Dick James, Senior Technology Analyst, Chipworks It’s the time in the media world that we see a frenzy of predictions for the coming year. They are mostly business or tech trends, so I figured I...
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ASMC 2016 Conference Has Highest Attendance Ever, Chipworks Achieves Twelfth...
By Dick James, Senior Technology Analyst, Chipworks It’s spring in the north-eastern part of North America, and that means it’s the time of year for the Advanced Semiconductor Manufacturing Conference,...
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